$21.99 $17.59

Solder Bar 63/37 (Sn\Pb) 400-500Grams per Pc

This 63/37 Tin-Lead Solder Bar (Sn/Pb) offers a eutectic alloy composition, making it an ideal choice for precision wave, dip, and hand soldering applications. With a melting point of 183C, the eutectic ratio (63% Tin, 37% Lead) ensures a clean, sharp transition from liquid to solid, minimizing cold solder joints and enhancing overall solder reliability.

Whether used in electronics manufacturing, repair labs, or industrial soldering stations, this solder bar delivers excellent wetting properties, consistent flow, and superior joint strength across a wide range of components and PCB surfaces.

Key Features:

  • Composition: 63% Tin (Sn), 37% Lead (Pb) eutectic alloy

  • Melting Point: 183C fast solidification and minimal bridging

  • Application: Ideal for wave soldering, dip soldering, and general-purpose electronics work

  • Purity: Low impurity levels for consistent results

  • Durability: Produces strong, shiny, and reliable solder joints

  • Shape: Solid rectangular solder bar (not wire or paste)

Typical Specifications:

ParameterValue
Alloy RatioSn 63% / Pb 37%
Melting Point183C
FormBar (Rectangular)
Weight~400g to 500g (depending on batch)
UsageElectronics Assembly, Wave/Dip Soldering

Applications:

  • Wave soldering machines

  • Electrical & electronic repair

  • PCB assembly lines

  • Dip soldering stations

  • Hobbyist & industrial electronics

SKU:US31201844 Category:

Solder Bar 63/37 (Sn\Pb) 400-500Grams per Pc

This 63/37 Tin-Lead Solder Bar (Sn/Pb) offers a eutectic alloy composition, making it an ideal choice for precision wave, dip, and hand soldering applications. With a melting point of 183C, the eutectic ratio (63% Tin, 37% Lead) ensures a clean, sharp transition from liquid to solid, minimizing cold solder joints and enhancing overall solder reliability.

Whether used in electronics manufacturing, repair labs, or industrial soldering stations, this solder bar delivers excellent wetting properties, consistent flow, and superior joint strength across a wide range of components and PCB surfaces.

Key Features:

  • Composition: 63% Tin (Sn), 37% Lead (Pb) eutectic alloy

  • Melting Point: 183C fast solidification and minimal bridging

  • Application: Ideal for wave soldering, dip soldering, and general-purpose electronics work

  • Purity: Low impurity levels for consistent results

  • Durability: Produces strong, shiny, and reliable solder joints

  • Shape: Solid rectangular solder bar (not wire or paste)

Typical Specifications:

Parameter Value
Alloy Ratio Sn 63% / Pb 37%
Melting Point 183C
Form Bar (Rectangular)
Weight ~400g to 500g (depending on batch)
Usage Electronics Assembly, Wave/Dip Soldering

Applications:

  • Wave soldering machines

  • Electrical & electronic repair

  • PCB assembly lines

  • Dip soldering stations

  • Hobbyist & industrial electronics

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