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This product is a thermally conductive but electrically insulating system that suits all transistors. It has excellent heat dissipation characteristics and fills even minute air gaps between mating surfaces, reducing thermal impedance. The compound will not harden, dry out, or melt even after approximately 1000 hours at 200C. It is a good single component modified silicone system suitable for heat sink applications.
It finds application in mounting studs of transistors, diodes, and silicone rectifiers to provide effective heat seal and improve thermal conductivity at heat sink junctions.
Images are for illustration only; actual product may vary.
This product is a thermally conductive but electrically insulating system that suits all transistors. It has excellent heat dissipation characteristics and fills even minute air gaps between mating surfaces, reducing thermal impedance. The compound will not harden, dry out, or melt even after approximately 1000 hours at 200C. It is a good single component modified silicone system suitable for heat sink applications.
It finds application in mounting studs of transistors, diodes, and silicone rectifiers to provide effective heat seal and improve thermal conductivity at heat sink junctions.
Images are for illustration only; actual product may vary.
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