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Solder Bar 63/37 (Sn\Pb) 400-500Grams per Pc
This 63/37 Tin-Lead Solder Bar (Sn/Pb) offers a eutectic alloy composition, making it an ideal choice for precision wave, dip, and hand soldering applications. With a melting point of 183C, the eutectic ratio (63% Tin, 37% Lead) ensures a clean, sharp transition from liquid to solid, minimizing cold solder joints and enhancing overall solder reliability.
Whether used in electronics manufacturing, repair labs, or industrial soldering stations, this solder bar delivers excellent wetting properties, consistent flow, and superior joint strength across a wide range of components and PCB surfaces.
Key Features:
Composition: 63% Tin (Sn), 37% Lead (Pb) eutectic alloy
Melting Point: 183C fast solidification and minimal bridging
Application: Ideal for wave soldering, dip soldering, and general-purpose electronics work
Purity: Low impurity levels for consistent results
Durability: Produces strong, shiny, and reliable solder joints
Shape: Solid rectangular solder bar (not wire or paste)
Typical Specifications:
| Parameter | Value |
|---|---|
| Alloy Ratio | Sn 63% / Pb 37% |
| Melting Point | 183C |
| Form | Bar (Rectangular) |
| Weight | ~400g to 500g (depending on batch) |
| Usage | Electronics Assembly, Wave/Dip Soldering |
Applications:
Wave soldering machines
Electrical & electronic repair
PCB assembly lines
Dip soldering stations
Hobbyist & industrial electronics
Solder Bar 63/37 (Sn\Pb) 400-500Grams per Pc
This 63/37 Tin-Lead Solder Bar (Sn/Pb) offers a eutectic alloy composition, making it an ideal choice for precision wave, dip, and hand soldering applications. With a melting point of 183C, the eutectic ratio (63% Tin, 37% Lead) ensures a clean, sharp transition from liquid to solid, minimizing cold solder joints and enhancing overall solder reliability.
Whether used in electronics manufacturing, repair labs, or industrial soldering stations, this solder bar delivers excellent wetting properties, consistent flow, and superior joint strength across a wide range of components and PCB surfaces.
Key Features:
-
Composition: 63% Tin (Sn), 37% Lead (Pb) eutectic alloy
-
Melting Point: 183C fast solidification and minimal bridging
-
Application: Ideal for wave soldering, dip soldering, and general-purpose electronics work
-
Purity: Low impurity levels for consistent results
-
Durability: Produces strong, shiny, and reliable solder joints
-
Shape: Solid rectangular solder bar (not wire or paste)
Typical Specifications:
| Parameter | Value |
|---|---|
| Alloy Ratio | Sn 63% / Pb 37% |
| Melting Point | 183C |
| Form | Bar (Rectangular) |
| Weight | ~400g to 500g (depending on batch) |
| Usage | Electronics Assembly, Wave/Dip Soldering |
Applications:
-
Wave soldering machines
-
Electrical & electronic repair
-
PCB assembly lines
-
Dip soldering stations
-
Hobbyist & industrial electronics
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